COVID-19 Epidemic accelerates digital transformation, including 5G smartphones, notebook desktops, tablets, servers, artificial intelligence and cloud high performance (AI / HPC) application shipment, driving related chips sustainable for inquiishing and prices rose. In addition, the new specification chip expands in the scale of the foundry, and is expected to synchronize IC test board manufacturers.

According to Tai Media Business Times, industry forecast, in a new generation of 5G mobile phone chips, central processing unit (CPU), image processor (GPU), WiFi 6 / 6E network chip, artificial intelligence (AI) accelerator, high performance calculation (HPC) Chip and the like began to put the tissue, the demand for wafer or IC test board, wafer probe card, IC aging test carrier, etc., industry vendor performance will continue to grow in the third quarter.

In the second half of this year, Liaotai, Qualcomm will launch a new 5G mobile phone chip using 6nm and 5nm advanced process, Apple's new iPhone 13 chip supply chain has also entered the shipment season, including China Jingsi, Wang Shen, Yi Zhi, Yingothyo and other tests The interface factory maintains an optimistic look on the peak season effect in the second half of the year.

In addition, as 5G applied penetration continues to increase with digital transformation, the cloud and edge calculations are fully landed, and the WiFi 6 / 6E wireless network chip, the AI ​​/ HPC processor, the CPU and GPU strong pull kinetic energy can be improved. Including Apple, Gao Tong, Lianfa, Ruijing, Boyong, AMD, and Yida, etc. have improved the third quarter and the fourth quarter to punch, synchronously tested the strong demand for the test interface products.

In the third quarter to the development of test interface technology in the second quarter of next year, the mainstream processor such as 5G mobile phone chip and application processor, CPU and GPU, AI / HPC processor, miniature to 5 nm, need to use fine spacing wafer test board , Vertical probe card and MEMS probe card, China Taiwanese manufacturers such as refinement, Yi Zhi, Wang Shen, etc., the order has been seen in the first half of next year.

At the same time, 5G drives the cloud and edge calculation, and the AI ​​/ HPC calculation is omnipotent, the complexity of heterogeneous integration and advanced 3D packaging process is improved, and the requirements for reliability are increasing, and new challenges are also given to the chip test interface technology. In response to this, the International Plant has enforced the chip to ship the chip to ship the Burn-in process. Industry insiders are optimistic about the finisher, Xiao Zhi, Youso and other operators will have greatly gain a sharp increase in the IC aging test carrier and aging test holders.