According to industry sources, it is expected that OSAT will increase the price of the lead bond package in the first half of 2022 to reflect the continuous increase in material costs such as lead frames and mold plastics due to shortages.

Digitimes invoked sources, many OSATs have increased line quotation in the first half of 2021 to increase the price of packaging materials. Most of which OSAT promises to continue to rise in the second half of the year, but will cancel the service fee discount in the peak season.

However, in view of Malaysia to prevent control of new crown epidemic proliferation, many material manufacturers have been reducing capacity, causing lead frames and molding prices to rise in July. According to sources, OSAT will not choose to increase the offer, and the cost increase part will pass the cost increase to the customer in the first half of 2022.

According to as, despite the sales of TV, notebook computers and other consumer electronics, it may be adjusted in the fourth quarter of 2021, but including Sun Moonlight, Superfeng Electronics, Lingzheng, Osat, 2022, 2022 The quarter is used to handle all kinds of MCU, PMIC, T-CON chip and USB interface IC lead bonding capacity have been booked.

It is reported that most of the above OSATs are expanded to enlarge line package production capacity to meet growing demand. Many chip manufacturers have also begun to book new capacity that has not yet been opened.