Intel CEO PAT GELSINGER recently said that the company will build a wafer in the US and Europe to make global semiconductor supply chains more flexible. He said that the United States will be able to accommodate 6 to 8 calenders, and it is expected to invest $ 100 billion in the next decade.

According to Washington Post, Pat Gelsinger said in an interview online, a new crystal circle is required to start operations 2-3 years, while a large-scale advanced factory takes nearly 4 years. Therefore, the market is returned to supply and demand, and it takes a long time. "I believe that the problem of this year (semiconductor shortage) may bottom out, but bad, I think we will still be busy with this issue until it will meet the appropriate supply and demand balance next year."

According to it, Intel is urged to promote construction teams and foundry business teams, as well as equipment manufacturers accelerate speed and produce equipment as soon as possible. However, helping customers transition from old nodes to new nodes, still need new design and re-authentication, which also takes time. Therefore, there is no shortage of shortage.

However, Pat Gelsinger pointed out that "we need a more flexible and global supply chain".

In 1990, the United States manufactured 37% of semiconductors in the world, 44% from Europe, and the rest were Asia's share. But now the US share is 12%, Europe is 9%, and Asia is almost 80%. "The industry has become too concentrated, which is more concerned about supply chain compared to supply chain, but with all kinds of emergencies suddenly broke out, people began to realize the flexibility of the supply chain more important.

Pat Gelsinger said that Intel will build a wafer factory in the US and Europe. If 10 years, semiconductor manufacturing propals in the United States, Europe and Asia reached 30%, 20% and 50% respectively, and this ratio will make everyone feel satisfied.

He also mentioned the importance of the US semiconductor manufacturing incentives. According to the data mastered, the cost of building a wafer plant in Asia is 30%, and if Intel builds a factory in China, the cost will decrease by 50%. The cost of a wafer factory is around 100-15 billion US dollars, which means that different plant places will have billions of dollars in cost gap. Therefore, if the US Wafer Factory wants to get a competitive advantage, it is necessary to get 30% -50% of funded subsidies. Therefore, Intel Hope Chip Act can pass as soon as possible, so it is conducive to Intel to build a new wafer factory faster.

Pat Gelsinger said that Intel is placing its attention throughout the US. The new plant location will have a very large area, which can accommodate 6 to 8 cavers, and each wafer will cost 100-15 billion US dollars. In the next decade, Intel will invest $ 100 billion, and create 10,000 direct employment positions and drive 100,000 indirect employment. In essence, the MEGA-FAB in the Intel Plan is a small city. Pat Gelsinger added, I hope to announce the location of the location before this month.

At present, Although Intel is behind TATES and Samsung in the field of process technology, Intel is seeking to narrow the gap and will resume in the next few years to the industry leadership status.