According to industry sources, including long-term technology, Tongfu Microelectronics, China's mainland block testing factory, China, is committed to improving the automotive chip QFN (Quad Flat No-Leads Package, square flat-free package) package capabilities .

The Electronic Times reported that the above-mentioned person said that the QFN package has a cost-effective, replacing BGA and QFP, becoming a key technique for processing car chips and other mature chips, including IT applications.

In the field of automotive chip, long technology continues to advance the car SIP module package and 77GHz radar system EWLB package technology. The above sources pointed out that the QFN technology of Long Technology has been verified to package the motion sensor required to encapsulate the vehicle safety system and the driving stability test system, which has been put into mass production.

It is reported that China's Taiwan OAST giant Sun Moonlight has won long-term orders for leading automotive chip IDMs with its A-FQN patented technology, and Superfeng Electronics also have a solid status in this area. Signals believe that QFN and other traditional package technology will continue to make progress in mature chips, China's Taiwan and China's OAS will maintain "cooperative relationship" within a period of time.