TSMC does not comment on market rumors related to the 3nm process. Industry insiders pointed out that TSMC and Samsung compete fiercely in advanced manufacturing processes and overseas layouts. Samsung is currently leading the investment in new plants in the United States and intends to overtake vehicles in 3nm mass production time-course curves. The weight of TSMC such as Qualcomm and Supermicro is reported. Class customers are interested in introducing Samsung's 3nm process.

According to industry sources, TSMC is actively speeding up mass production of 3nm in the face of Samsung. If mass production of 3nm can be made ahead of schedule, it is expected that the first batch of customers will include major manufacturers such as MediaTek and Huida. MediaTek Chief Executive Cai Mingjie announced recently that it is working closely with TSMC. 5nm and 4nm products are already in mass production, and 3nm will be the next process.

TSMC and Samsung have a completely different 3nm architecture. TSMC follows the existing FinFET architecture, while Samsung uses a new surround gate technology (GAA). TSMC believes that the fin-type field-effect transistor architecture can provide customers with the most mature technology, the best performance, and the best cost. It has been developed according to the plan and is progressing well. It has also continued to observe 3nm in high-performance computing and There is more customer input in smart phone applications.

TSMC originally planned that the 3nm process will be trial-produced at risk within this year. Mass production is expected to begin in the second half of next year. It is another process technology with large-scale and long-term demand.

Now it is reported that the mass production of TSMC's 3nm process is ahead of schedule, and related supply chains such as Zhongsha and Gudeng are also moving. Among them, China Sands diamond disc products have been supplied to TSMC for many years, but during the 5/7/10 nanometer process stage, it was once threatened by other foreign competitors. It is reported that China Sands has regained more than 50% of the high in the 3 nanometer process. City occupancy.

China Sands does not comment on customer-related orders. The legal person believes that TSMC’s advanced process diamond discs have a higher unit price than mature process diamond discs. The 3nm-related shipments have started to reflect Zhongsha’s revenue in October and will follow in the market. Driven by the dual factors of high account and higher unit price, the company's profit can be expected.

Gudeng extreme ultraviolet (EUV) mask boxes are currently mostly supplied for 5nm process applications. The legal person expects that with the mass production of TSMC’s 3nm process next year, the amount of related EUV mask boxes will also increase. The performance ratio of carriers and wafer carriers may reach 6:4.