On January 8, the official website of the global MLCC manufacturer Murata Manufacturing Co., Ltd. stated that its subsidiary Sabae Murata Manufacturing Co., Ltd. will start the construction of a new research and development building in February 2022. The purpose of this new research and development building is to develop electronic Electroplating technology for components such as light, thin and short, and the establishment of mass production technology.

The construction part of Murata's new research and development building has a total investment of 6.4 billion yen (about 353 million yuan) and a construction area of 1,797 square meters. It is scheduled to be completed in August 2023 and is mainly used for the development and establishment of electroplating technology.

Some Taiwanese media reported that the electroplating coating of electronic parts helps solder adhesion and facilitates the installation of electronic parts on circuit boards. In recent years, electronic components such as MLCCs have been developing in the direction of miniaturization, and the level of requirements for electroplating technology has become higher and higher. In order to meet the relevant needs, Murata also decided to invest heavily in the research and development of materials and technologies.