Faced with sanctions that prevent it from getting chips from regular suppliers, Russia is drawing up plans to revive its ailing local semiconductor manufacturing, with plans for new chips involving sizable investments over the next eight years.
The Russian government has drawn up a preliminary version of a new microelectronics development plan that will require an investment of about 3.19 trillion rubles ($38.43 billion) by 2030, according to tomshardware. According to Cnews, the funds will be used to develop local semiconductor production technology, local chip development, data center infrastructure, the cultivation of local talents, and the marketing of domestic chips and solutions.
In semiconductor manufacturing, Russia plans to invest 420 billion rubles ($5 billion) in research and development of new manufacturing technologies. One of Russia's short-term goals is to increase local chip production using 90nm manufacturing technology by the end of this year, and the long-term goal is to build a manufacturing system using the 28nm node by 2030, a goal that TSMC achieved in 2011.
The plan will be finalized on 22 April 2022 and submitted to the Prime Minister for formal approval.
Historically, Russia has been fairly successful in software and high-tech services, but relatively laggard in chip design and manufacturing. In order to cultivate local talents and develop chips domestically, Russia plans to establish a "foreign solution" reflow project by the end of the year to transfer manufacturing to Russia. By 2024, all digital products should be produced domestically. Products that cannot be produced domestically are expected to be sourced from China.
Whether Russia, without access to technologies developed in the US, UK, or Europe, can achieve its goals in 2024 or 2030 is still unknown. But that doesn't mean there isn't one possible answer.
Foreign media: Russia plans to launch a new semiconductor plan to achieve 28nm localization by 2030
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