On April 12, according to the Taiwanese media "Economic Daily", the delivery time of semiconductor packaging continued to be extended. Sondrel, an IC design service consulting company, pointed out that due to the change in the order of production capacity reservations in the semiconductor supply chain, and the need for new packaging capacity and personnel training, it will take time. Package lead times have been extended to 50 weeks.
Sondrel, a UK-based IC design service consulting firm, pointed out that in the early days of the outbreak of the new crown epidemic, packaging factories faced the situation of customers cutting orders. However, with the recovery of semiconductor production capacity, packaging factories have tried their best to solve the large number of orders that hit like a tsunami. , but building new capacity and training skilled operators will take time.
In addition, Sondrel analyzed that the previous order of production capacity in the semiconductor supply chain has changed. In the past, the time course for the IC design end to be completed first and then handed over to wafer manufacturing was about 12 weeks. At the same time, the packaging details will also be prepared by the packaging factory before entrusting the foundry.
The current situation is that it takes at least 20 weeks to complete the package design and production capacity before the semiconductor design, to ensure that the wafer fabrication and packaging can be completed together. Sondrel said that if the new semiconductor manufacturing process pattern mentioned above is not noticed, the chip production cycle will be delayed to about 40 weeks.
ASE Investment Control, a major packaging and testing company, previously pointed out that the semiconductor industry continues to expand capital expenditures, equipment delivery continues to extend, and the supply of wafers, carrier boards, lead frames, etc. is still tight. However, according to customer information, semiconductor production capacity and supply chain constraints will continue beyond 2023.
Agency: Due to changes in the semiconductor supply chain process, the packaging lead time has been extended to 50 weeks
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