On May 9, DIGITIMES reported that Winbond Electronics, a professional DRAM and flash memory manufacturer, said that the role of memory chips is becoming more and more important in heterogeneous integration, and the company is working with potential customers in several related design projects. cooperate.

Focusing on good demand for AI-capable chips and devices utilizing heterogeneous integration, Winbond Electronics said the company will focus on high-performance computing (HPC) and smart IoT chip design to accelerate deployment in this field.

In addition, the company said it will develop next-generation memory solutions for heterogeneous integrated designs that require high bandwidth and high-performance computing. At present, large-scale international counterparts such as Samsung Electronics and SK Hynix have entered this field.

In 2021, Samsung launched a high-bandwidth memory (HBM-PIM) that supports in-memory processing (PIM) and incorporated AI processing capabilities into its HBM2 Aquabolt to enhance the high-speed data processing capabilities of supercomputers and AI applications, the report said.

Earlier in 2022, SK hynix released its next-generation PIM memory chip with computing power and developed a GDDR6-AiM (memory accelerator) sample. SK hynix expects GDDR6-AiM to be widely used in machine learning, high-performance computing, big data computing and storage.

For various smart IoT applications requiring low power consumption and simple design, Winbond has developed HyperRAM series with densities ranging from 256Mb to 512Mb. Winbond expects that HyperRAM chips will appear in wearable devices launched in the second half of this year (July to December) at the earliest.