简体中文 English User Ctrl
User Ctrl
简体中文
简体中文 English
News Center

UMC Japan subsidiary will cooperate with Denso to manufacture automotive power semiconductors

Feb 02 74
UMC, a Taiwan-based wafer foundry, announced today (26) that UMC's Japanese subsidiary USJC will cooperate with Denso (DENSO) in the manufacture of automotive power semiconductors, and will build an IGBT production line for DENSO.

It is reported that DENSO will provide its system-oriented IGBT components and process technology, while USJC will provide 12-inch wafer fab manufacturing capabilities. It is expected to achieve mass production of IGBT processes on 12-inch wafers in the first half of 2023. This collaboration has been supported by Japan's Ministry of Economy, Trade and Industry's Necessity Semiconductor Carbon Reduction and Retrofit Program.

Wang Shi, co-general manager of UMC, said that this is a major project of UMC, which will expand its importance and influence in the field of automotive electronics. With a strong portfolio of advanced specialty processes and fabs in different regions, UMC is well-positioned to meet the needs of the automotive sector, including advanced driver assistance systems, infotainment, connectivity and powertrains.

Koji Arima, President and CEO of DENSO, said: "DENSO is pleased to be one of the first companies in Japan to start mass production of IGBTs on 12-inch wafers. With the development of mobile technologies, including autonomous driving and electrification, semiconductor It is becoming more and more important in the automotive industry. Through this cooperation, we are contributing to the stable supply of power semiconductors and the electrification of vehicles."