ASE today announced the launch of the VIPack advanced packaging platform, which provides vertically interconnected integrated packaging solutions.

It is reported that VIPack is ASE's next-generation 3D heterogeneous integration architecture that expands design rules and achieves ultra-high density and performance design. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D/3D packaging technologies to help customers integrate multiple chips in a single package for innovative future applications.

ASE VIPack consists of six core packaging technologies, which cooperate through a fully integrated ecosystem, including Fan Out Package-on-Package (FOPoP) based on high-density RDL, Fan Out Chip-on-Substrate (FOCoS), Fan Out Chip-on-Substrate-Bridge (FOCoS-Bridge) and Fan Out System-in-Package (FOSiP), as well as through-silicon via (TSV) based 2.5D/3D ICs and Co-Packaged Optics. In addition to providing pioneering highly integrated silicon packaging solutions that optimize clock speed, bandwidth and process capability for power delivery, the VIPack platform reduces co-design time, product development and time-to-market.

"Key innovations such as double-sided RDL interconnects have spawned a series of new vertically integrated packaging technologies, creating a solid foundation for the VIPack platform," said Mark Gerber, Senior Director of ASE Technology Camp and Promotion.