According to a report on the US protocol website, the US-EU Trade and Technology Committee (TTC) meeting held recently, the US has achieved more than expected results.
IBM executive Christopher Padilla said that the industry expected that the two sides would mainly discuss the regulation of the technology industry at the meeting, but the conflict between Russia and Ukraine has caused a major change in the priorities of the technology field, and the United States and Europe have a common understanding of building local semiconductor manufacturing capabilities. sense of urgency.
Adi Rao, an academic at Cornell University, said Europe's massive subsidies for semiconductor fabs are not based on economic reasons, but are driven by anxiety about security.
Padilla also revealed that the tight supply chain has made government officials generally aware that semiconductor manufacturing is too dependent on Northeast Asia, especially Taiwan, which is unacceptable.
The TCC statement mentioned that the United States and Europe will strengthen coordination and design a transatlantic semiconductor investment policy that avoids subsidy competition. Rao believes that although this move shows that the two sides are consciously avoiding the "bottom competition" game, it is easier to know than to do, and to worry about national security In the future, competition for semiconductor manufacturing capacity is still inevitable. Rao is also worried that the re-distribution of semiconductor manufacturing capacity distorted by government subsidies will push up the prices of consumer electronics products rather than reduce them, increasing the burden on consumers.
US media: Russia-Ukraine conflict catalyzes US-EU cooperation in science and technology policy
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