Recently, Haowei Technology announced that the Cuckoo 2 chip, a 3D packaged near-memory computing chip successfully mass-produced last year, has made another breakthrough in the application of advanced packaging technology: it has become the first in China to successfully realize a large chip (800mm²) full RDL routing package instead of a substrate Encapsulate and implement risky mass production for enterprises.

From foundries, packaging plants to IC design companies and system manufacturers, advanced packaging has been taken as a direction to break through Moore's Law. As the back-end process of wafer manufacturing, advanced packaging continues to play an important role in continuously compressing chip volume, improving processing efficiency, improving design efficiency and reducing costs. Compared with traditional packaging, advanced packaging has three major functions: improving the functional density of chips, shortening the interconnection length, and performing system reconstruction. Among them, the application of RDL (Re-distributed layer) technology is indispensable.

The success of Haowei's full RDL routing risk mass production will further strengthen the chip technology advantages and product layout in the metaverse fields such as artificial intelligence, blockchain, 3D space computing and 8K high-definition requirements, and also develop advanced processes and technologies. The new model of supply chain cooperation of advanced packaging makes the delivery cycle shorter and the production capacity has a double guarantee.

Haowei Technology hopes to meet the computing needs of the upcoming metaverse era blowout through continuous technological iteration.

Nano Labs, the parent company of Haowei Technology, has been listed on Nasdaq (Nasdaq: NA).