TSMC, the world's largest chip foundry company, abandoned the EUV (EUV lithography) in the first generation of the 7nm process. At the same time, it integrated the fan-out package technology to improve reliability, and finally made its progress surpass Samsung and won a series of customers. Big single.
In October 2018, Samsung Electronics announced that its 7nm LPP (Low Power Plus) process has also entered mass production, while TSMC's second-generation 7nm with EUV equipment is expected to be mass-produced in 2019.
7nm node wins and losses have been divided? Multi-data perspective comparing Samsung and TSMC
Feb
02
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