Intel's first 3D package processor Lakefiled, using 10nm process

  For the first time in the architecture day event, Intel announced the new 3D hybrid package design "Foveros" for the first time. At CES 2019, Intel announced the first Foveros hybrid package-based product, "Lakefield" for notebook mobile platforms. Foveros is a brand new 3D chip packaging technology. It introduces 3D stacking design for CPU processor for the first time. It can realize chip stacking on chip and integrate chips of different processes, structures and applications, which can greatly improve the flexibility of chip design and facilitate Achieve richer, more suitable features for maximum performance or lowest power consumption.

Lakefiled integrates five CPU cores, divided into one large core and four small cores, all manufactured in a 10nm process. The large core architecture is the recently announced next-generation Sunny Cove with its own 0.5MB LLC cache, four small. The core architecture has not been announced, perhaps the new Atom, which shares 1.5MB of L2 cache, while all cores share 4MB of L3 cache.