TSMC expands Open Innovation Platform Cloud Alliance, 5nm test chip completes verification in 4 hours

  Wafer foundry company TSMC announced on the 26th that it will expand the Open Innovation Platform (OIP) cloud alliance, in which Mentor joins the ranks of founding members AWS, Cadence, Microsoft Azure and Synopsys, becoming a new force in the alliance and expanding the TSMC Open Innovation Platform ecosystem. The scale of the system and the ability to use new cloud-ready design solutions to help customers use TSMC's process technology to unleash innovation.

TSMC said that Mentor has successfully passed the certification to become a new member of the Cloud Alliance, and its procedures for protecting Silicon Smart in the cloud are in line with TSMC's standards. In addition, TSMC validated the Mentor Calibre Entity Validation Electronic Design Automation solution, which effectively accelerates chip entity verification through the scalability of cloud computing. Through collaboration between Mentor, Microsoft Azure and TSMC, TSMC's 5nm test chip was able to quickly complete physical verification in less than 4 hours, thanks to the productivity gains of Calibre on the cloud. Such excellent performance demonstrates the power of cloud computing, and by combining TSMC's expertise and partner innovation kinetic energy, it provides more choices for common customers to optimize the timeline of product design.