Recently, Gexin and Soitec announced that they have signed long-term long-term supply agreements for 300mm SOI chips to meet the growing demand of grid customers for SOI, RF-SOI, FD-SOI and silicon photonic technology platforms. Based on the existing close relationship between the two companies, the agreement is effective immediately to ensure high-level mass production in the next few years.

Through the leading position of the two companies in the industry, RF-SOI solutions are 100% applied to today's smartphones. FD-SOI has become the standard technology for high-cost, low-power devices for high-volume consumption and IoT applications, as well as mission-critical security solutions for automotive proximity sensing. Silicon photonics technology enables solutions to support the massive growth of data center and next-generation 5G communication optical network communication infrastructure.

“Grid is providing industry-leading technologies that are highly differentiated for 5G, IoT, data center and automotive applications,” said Bami Bastani, Senior Vice President of Gexin. “These long-term agreements with key partner Soitec represent our commitment to ensure the secure supply of ultra-low power, high performance SOI solutions and to meet the rapidly growing needs of customers in these attractive markets and Unprecedented demand."

“Grid is an industry leader in providing differentiated SOI solutions, creating more demand for Soitec's engineering substrates,” said Soitec CEO Paul Budley. “These agreements reflect the strength of our long-term partnership as we build the necessary capabilities to meet the growing demand for SOI.”