According to the Chongqing Morning Post, SK Hynix Semiconductor (Chongqing) Co., Ltd. Director of External Cooperation, Jiang Zhenshou, revealed that after the equipment installation and commissioning of the SK Hynix Chongqing chip packaging project (ie the second phase project) is completed, it will be put into production in September.

Jiang Zhenshou said that at present, the packaging and testing are completed in the first phase of the project. After the completion of the second phase of the project, the first phase of the project will focus on testing and the second phase will focus on packaging.

It is reported that after the completion of the second phase of the SK hynix Chongqing project, the combined capacity of the first phase and the second phase will be 2.5 times the existing capacity. The annual production of chips will be close to 2 billion. By then, Chongqing's annual production of chips will account for more than 40% of the entire SK hynix flash memory products, becoming the world's largest overseas packaging and testing base.

SK Hynix's second phase of the project has invested a total of US$1.2 billion to build a NANDFlash package test production line. On May 10, 2013, as a city-level key introduction project, Chongqing signed an agreement with South Korea's SK Hynix Semiconductor. SK hynix established SK Hynix Semiconductor (Chongqing) Co., Ltd. in Xiyong Microelectronics Park, invested in the construction of NANDFlash memory chip packaging and testing production line, and is responsible for semiconductor post-processing services, including the construction of chip packaging, testing, modules and other production lines.