As the COVID-19 epidemic spreads globally, the China Taiwan Information Council (MIC) analysis pointed out that the epidemic may impact IDM factories in Europe and America and their packaging and testing capacity in Southeast Asia, despite the IC design, wafer foundry, memory and IC packaging The impact is not significant, but the passive component MLCC may increase prices due to tight supply of the epidemic.

According to a report by the Central News Agency, the Industrial Intelligence Research Institute (MIC) report analysis of the Capital Policy Committee shows that Europe and the United States are mainly important places for global integrated semiconductor device manufacturing (IDM) factories. Use electronics, power semiconductors and other products.

The report pointed out that the epidemic has less impact on chip manufacturing than other industries, but some large factories have reduced the number of employees due to epidemic prevention measures, and some production capacity in Europe has been affected.

According to MIC analysis, under the logistics and government control policies, IDM-based European and American semiconductor manufacturers will be hit. At the same time, most of IDM's products are market oligopoly, and have exclusive patented technology and high reliability requirements, it is difficult to deliver OEM to supplement production capacity in the short term.

At the same time, because most IDM manufacturers' packaging and testing capacity is concentrated in Southeast Asia, if the epidemic expands in Southeast Asia, the local government tightens control policies, which may affect the capacity of local packaging and testing factories, which may have another impact on IDM manufacturers.

In addition, MIC pointed out to the IC design industry that IC design has no direct production line personnel and has a high degree of remote work. Most of the chip manufacturing committees are produced by foundries. At present, IC design bases in mainland China and Taiwan are not affected to a great extent, but product verification time may be extended, and due to poor terminal demand, new product shipments may be delayed.

In terms of wafer foundry, MIC analyzed that the main production capacity is concentrated in mainland China, Taiwan, and South Korea. The related production capacity is currently affected to a slight extent, but order demand may decline due to the impact of consumption.

In the memory sector, MIC said that it is expected that the price of memory will fall due to a decline in demand starting in April.

In addition, in the IC packaging and testing section, MIC pointed out that the main factories are concentrated in mainland China, Taiwan, South Korea and Singapore. The epidemic has a slight impact on production capacity. However, due to the impact of consumption, the growth momentum of packaging and testing capacity may be significantly slowed this year.

On the other hand, although the epidemic has little effect on IC design, wafer foundry, memory, and IC packaging and testing, the passive component MLCC may increase in price due to tight supply of the epidemic. MIC pointed out that since the Philippines is an important production base for MLCC, the epidemic situation may reduce the supply of MLCC in the market, and the price may increase.