According to Juheng.com, foundry leader TSMC held a shareholders meeting today (9). For the progress of advanced processes, Chairman Liu Deyin said after the meeting that the progress has not been affected by the epidemic. 5 nanometers will be mass-produced and shipped next year. 5nm is expected to be mass-produced in 2022, and the 4nm process equivalent to the third edition of 5nm will also be mass-produced in 2023.

A few days ago, it was reported that due to the epidemic, TSMC decided to postpone the 5 nanometer production expansion and 3 nanometer trial production schedule. Liu Deyin responded today that the epidemic did not affect the advancement of advanced processes. The 5 nanometer production capacity currently seems to be vacant, but I believe it will be made up soon. It is reported that the expansion of the US ban on Huawei has led HiSilicon to vacate a 5nm capacity gap. However, it is reported that this gap may be filled by at least five customers including AMD, Intel, Xilinx, Qualcomm, Bitmain and MediaTek.

At the same time, Liu Deyin said that the 5 nanometer process is expected to be mass-produced and shipped next year. The enhanced 5 nanometer process will be mass-produced in 2022. Currently, it is also developing a 4 nanometer technology equivalent to the third version of the 5 nanometer process. All three devices can be used universally. , Mass production is expected in 2023.

In addition, in terms of special process technology progress, TSMC president Wei Zhejia said that GaN (gallium nitride) is currently making good progress, meets customer requirements, has high performance, high voltage and other characteristics, but it is still a small amount of production, and will be widely and widely used in the future. use.

For special memory, Wei Zhejia said that MRAM (Magnetoresistive Random Access Memory) has been produced in small quantities, but it may take 2 to 5 years to widely use all electronic products.