According to the Taiwan Media Technology News, the Institute for International Strategic Development of Industrial Technology of Taiwan Industrial Technology Research Institute held a seminar of Taiwan Semiconductor Industry Innovation Bureau yesterday (17). Looking ahead to the output value of the IC packaging and testing industry in Taiwan this year, analyst Yang Qixin predicts about NT$509.6 billion (the same below), an increase of 1.8% from last year's NT$500.7 billion.

Among them, the output value of the IC packaging industry in Taiwan will reach 352 billion yuan this year, an increase of 1.6% from last year's 346.3 billion yuan; the output value of the IC testing industry can reach about 157.6 billion yuan, an increase of 2.1% from last year's 154.4 billion yuan.

As for the performance of the IC packaging and testing industry in Taiwan in the second half of this year, Yang Qixin expects that if the epidemic affects consumption momentum in the second half of the year, it may indirectly affect the growth of IC packaging and testing.

Regarding the layout of advanced packaging and testing, Yang Qixin said that major packaging and testing factories have their own layouts. It is estimated that by 2024, advanced packaging and testing will account for 49.7% of the total packaging and testing output value, and the annual compound growth rate of advanced packaging and testing output value will be about 8.2%, which is better than other non-advanced packaging and testing output value at a compound annual growth rate of 2.4%, and all packaging and testing output value at a compound annual growth rate of 5%.

Advanced packaging includes flip-chip packaging, wafer-level fan-in and fan-out packaging, and embedded packaging.

Yang Qixin pointed out that the global packaging and testing factories have different proportions in the number of wafer-level packages. Most of the proportions are still based on flip chip packaging, followed by fan-in packaging and fan-out packaging (Fan-out). The proportion of each company is about 10% or less.

Observing the panel-level fan-out packaging market in Taiwan, Yang Qixin said that a hundred schools of thought are contending. ASE Semiconductor is the largest manufacturer with the most extensive fan-out packaging technology. Silicon Products also develops the fan-out packaging technology embedded in the winding. In addition, the memory packaging and testing plant is actively deploying high-end panel-level fan-out packaging technology. In addition, South Korea's Samsung Electronics has deployed 2D fan-out packaging technology, and in the future will move towards 3D system-in-package (SiP) technology.

On the whole, ASE, Amkor, Licheng, Samsung Electronics, and Nepes are all actively deploying panel-level fan-out packaging technology, and related applications start from power management chips (PMIC) to mobile application processors (AP). )direction.