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Intel Earthquake: The chief engineer leaves, and the technical department is divided into five

Feb 02 64
According to Taiwan Media Economic Daily, Intel's chief engineer Murthy Renduchintala will leave because the 7nm process will be delayed for at least 6 months, and the progress of research and development technology is behind the industry.

It is understood that Murthy Renduchintal is currently also the president of Intel's technology, system architecture and customer team. He will leave on August 3, and the team he leads will also be split and led by other supervisors.

Intel stated in a statement that this adjustment is "the focus and sense of responsibility for accelerating product leadership and improving process technology execution."

Renduchintala joined Intel in 2015 and is regarded as an important executive with power second only to Swann. He has served as Executive Vice President of Qualcomm and has been a director of Accenture since April 2018. After joining Intel, he was initially responsible for the customer and IoT business and system architecture teams. In 2016, he sent a memo to other senior executives to draw up a set of plans to deal with what he called the "competitiveness gap" situation and call for the need to upgrade Intel’s design business. Renduchintala was subsequently promoted to his current position.

The latest personnel changes show that Intel is reconsidering various directions of operation when it is experiencing production difficulties and the 7nm process is difficult to produce.

Renduchintala was originally regarded as a possible replacement for Kezaiqi. Kezaiqi resigned from the position of Intel CEO in 2018 because of personal affair with employees.

In addition, Renduchintala is also one of Intel's highest-paid executives, with a total annual salary of US$26.88 million as of the end of 2019.

Now as Renduchintala is about to leave, his team will be split into five organizations, including a technology research and development team led by Ann Kelleher, which will be committed to promoting the 7nm process.