South Korea's Samsung Electronics will start producing mobile chips (AP) and baseband chips with a 5-nanometer process from the end of 2020, and will actively compete with TSMC in the foundry market.

According to a report from ZDNet Korea on the 24th (Monday), Samsung Electronics will begin to use the 5-nanometer EUV process to produce Qualcomm's mobile chip Snapdragon 875 and 5G baseband chip Snapdragon X60 at the end of the year, as well as Samsung's own Exynos 1000 and other products.

According to the report, some senior executives in the Korean semiconductor industry pointed out that Samsung Electronics will begin mass production with a 5nm process from the second half of this year, mainly for fabless fabs for AP and baseband chip foundry; although there is news that Samsung’s The yield is not good, but that is just a rumor.

Although Samsung is eager to challenge the status of TSMC, TSMC is certainly not a fuel-efficient lamp. TSMC President Wei Zhejia stated on the 25th technology forum that the 7-nanometer has recently reached the milestone of 1 billion die shipments, and that the 5-nanometer is accelerating mass production. The enhanced version of the 5-nanometer process is expected to enter mass production next year, and the 4 nanometer is expected to be in 2022. For annual mass production, the progress of the two advanced manufacturing processes is earlier than the mass production schedule announced by the shareholders meeting in June this year.

Based on 5nm, TSMC has further expanded the 4nm process technology to meet a wide range of product needs. 4nm is more advanced in speed, power consumption, and logic density, and can reach 100% IP compatibility with 5nm. It can extend its existing design infrastructure and accelerate product innovation. It is expected in the fourth quarter of 2021 Trial production, target mass production in 2022. It is also earlier than the 2023 mass production schedule mentioned by the shareholders meeting.