According to Taiwanese media "Business Times", the foundry leader TSMC revealed more details of its 3nm process at the legal meeting last week.

It is reported that 3nm adopts FinFET architecture and EUV technology. The logic density of 3nm relative to 5nm will be increased by 70%, performance will be increased by 10-15%, power consumption will be reduced by 25-30% under the same performance, and the area will be 1/1.7 of the original. The number of EUV mask layers will double.

Previously, ASML CEO Peter Wennink pointed out at the financial report that the number of EUV mask layers used in the 5nm process will exceed 10, and the number of EUV mask layers used in the 3nm process will exceed 20. As the process shrinks, the number of EUV mask layers will be obvious. Increase and replace the deep ultraviolet (DUV) multiple exposure process.

In addition, the report stated that TSMC will actively purchase EUV lithography equipment and will remain the semiconductor factory with the world's largest EUV production capacity in the next 3 to 5 years.

In terms of advanced technology, TSMC has been at the forefront of the industry. The company's EUV technology has entered mass production and the process covers 7+nm, 6nm, and 5nm.

According to equipment manufacturers, TSMC 7+nm adopts up to four EUV mask layers, and AMD's new-generation Zen 3 architecture processors are expected to be mass produced using this process. 6nm has entered mass production in the fourth quarter, and the number of EUV masks has increased by one layer compared with 7+nm. Major manufacturers including MediaTek, NVIDIA, and Intel will use 6nm to produce new generation products.

Mass production of the 5nm process will begin in the second half of this year, mainly for Apple's mass production of A14 and A14X processors, including AMD, Qualcomm, Nvidia, Intel, Broadcom, etc., will introduce the 5nm process for mass production of new generation products after next year.

In addition, 3nm products will appear on the market in 2021, and mass production will begin in 2022.