The epidemic has accelerated the outbreak of server demand, and with the commercial launch of 5G, the shipment of high-speed network communication chips has increased, making the demand for ABF packaging substrates strong. According to this news, Japanese and Korean PCB manufacturers have shifted their production focus to IC substrates.

According to DIGITIMES reports, industry sources revealed that PCB manufacturers in Japan and South Korea have shifted their production focus from traditional multilayer rigid boards, even high-end HDI, flexible PCBs, and rigid-flex boards to IC substrates.

According to the report, due to strong demand for ABF packaging substrates used in high-performance computing (HPC) chips and CMOS image sensor chips, Japanese IC substrate suppliers Ibiden and Shinko Electric will be in 2020 Annual revenues have increased substantially.

The source pointed out that the two Japanese companies will continue to invest heavily in the expansion of ABF substrate production capacity, which is expected to account for more than 30% of Japan's PCB output value this year.

South Korea’s major PCB manufacturers LG Innotek, Semco, and Daeduck Electronics have stopped producing HDI boards or rigid-flex boards in recent years, focusing more on the flip chip size (FCCSP) used in the production of mobile phone SoC and 5G transmission chips. Such as BT package substrate, as well as AiP substrate and RF module substrate.

Sources pointed out that South Korea’s IC substrates are expected to grow rapidly and are expected to exceed 30% of the PCB output value.