According to foreign media reports, TSMC is working with Apple to jointly promote the research and development of the 2nm process, and it is expected that 2nm will begin trial production in 2023. In addition, in view of the expectations and huge demand of American companies such as Apple and Intel for the 3nm process, TSMC is further increasing the production capacity of the 3nm plant.

According to WCCFTECH reports, Apple has taken the lead in obtaining the first batch of orders for TSMC’s 3nm process. The new process will be used on chips in the iPhone, iPad and Mac product lines, and mass production is expected to begin in 2022.

Sources believe that Intel and TSMC have not yet reached an agreement on the allocation of 3nm wafers for Intel's core CPU/GPU IP. This decision will be made by Intel CEO Pat Gelsinger in the next few months. However, some of Intel's 5nm orders for core IP have already been placed to TSMC and confirmed by the former CEO of Intel. Therefore, it is expected that the non-core IP components that Intel regularly outsources will continue to be produced at TSMC, including 3nm.