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Industry: In 2024, there may be excess industrial capacity, and TSMC re-evaluates its expansion plan
Feb
From 2022, semiconductor demand has shown signs of decline, but foundry capacity expansion seems unstoppable, so there are concerns that the global foundry market may experience excess capacity in 2024.
According to Digitimes, the sources said that new production capacity of foundries and international IDMs will come online one after another from 2023, and produc…
Reuters: Broadcom CEO Hock Tan, a savvy trader in semiconductor M&A
Feb
Earlier this month, Broadcom CEO Hock Tan called VMware Chairman Michael Dell, who is also Dell's CEO, to offer $61 billion to buy VMware.
According to Reuters, Hock Tan, 70, is known in the industry for his ability to capture M&A opportunities and control transaction costs. The deal would boost Broadcom's market value to $225 billion.
Michael Dell and private…
Taiwan media: Data center server chip sales will grow strongly in 2022
Feb
On May 31, according to DIGITIMES, industry insiders said that despite the market’s recent concerns that Meta and Google may cut capital expenditures, TSMC and other chip makers have not seen a reduction in orders for data center applications.
There are rumors that Google and Meta plan to lower their capital spending outlook for this year. But neither cloud pro…
Sources say cloud service providers will reduce reliance on processor suppliers
Feb
On June 1, according to DIGITIMES, sources in the notebook industry said that cloud service providers will reduce their reliance on processor suppliers, as most of them want to develop their own Arm-based processors.
If the trend continues, the sources said, AMD and Intel's new generation of server processors will not be aligned with cloud service providers' serv…
ASE integrates six core packaging technologies and launches VIPack advanced packaging platform
Feb
ASE today announced the launch of the VIPack advanced packaging platform, which provides vertically interconnected integrated packaging solutions.
It is reported that VIPack is ASE's next-generation 3D heterogeneous integration architecture that expands design rules and achieves ultra-high density and performance design. The platform leverages advanced redistribu…
Intel teams up with CEA-Leti to develop self-assembled die-to-wafer advanced packaging technology
Feb
Intel and French research lab CEA-Leti have optimized a hybrid direct-bonding, self-assembly manufacturing process that could facilitate "die-to-wafer" (D2W) bonding applications .
According to eeNews, the D2W hybrid bonding process is considered a necessary process for bonding memory, high-performance computing chips and photonic chips on wafer substrates, but i…
Foreign media: Diodes officially takes over ON Semiconductor's South Portland 8-inch analog chip fab
Feb
Diodes has completed the acquisition of ON Semiconductor's South Portland, Maine Wafer Fabrication Facility (SPFAB) and operations.
Diodes aims to consolidate operations at the South Portland facility and fab, including transferring SPFAB employees to Diodes, Evertiq reported Monday. The company will also continue to manufacture ON Semiconductor's products at SPF…
Financial Times: Let the government own Arm gold shares is a bad idea
Feb
With the failure of Nvidia's acquisition of Arm, there has been rumors of "nationalization" of Arm in the UK again, and state-owned gold stocks have been put back on the agenda. In this regard, the British "Financial Times" wrote an article that gold stocks are a disgraceful solution with protectionism.
The article argues that during the wave of privatization in …
Reuters: U.S. senators to hold confidential briefing on semiconductors to advance $52 billion subsidy bill
Feb
(Reuters) - U.S. Senator Maria Cantwell will hold a confidential briefing with Pentagon officials and the chief executive of Intel Corp on Thursday for lawmakers to negotiate a plan for U.S. semiconductor manufacturing, sources said. Compromise measures to provide $52 billion in subsidies to the industry.
The briefing will examine supply chain threats critical to…
The output value of Taiwan's semiconductors in the first quarter increased by 28.1% year-on-year, and is expected to increase by 19.4% to NT$4.87 trillion for the whole year
Feb
On May 10, according to the Taiwanese media "Economic Daily", in the first quarter of 2022, the output value of Taiwan's semiconductor industry was NT$1.15 trillion, an increase of 4.8% quarter-on-quarter and 28.1% year-on-year (year-on-year). The International Institute of Obstetrics and Gynecology of the Industrial Technology Research Institute estimates that the …
Insufficient supply continues, distributors say industrial control IC suppliers may increase prices again
Feb
IC distributor sources said slowing demand for mobile phones, laptops and other consumer electronic equipment has led to a backlog of related IC inventories, but industrial control ICs are still in short supply, and suppliers have raised prices and may increase prices again to reflect the ongoing Chip shortages.
According to Digitimes, ANStek and other Taiwanese …
China's laptop production won't fully resume until July, sources say
Feb
On May 12, according to DIGITIMES, industry insiders said that the overall production of laptops in China is mainly concentrated in major coastal cities in eastern China, and it is unlikely to return to the level before the lockdown by July. Insufficient manpower and logistical issues were identified as major challenges.
According to the report, with the easing o…
Arm achieves record revenue of $2.7 billion in 2021, with Chinese joint ventures contributing about 20%
Feb
Arm Ltd, the chip technology company owned by SoftBank Group Corp., reported record 2021 revenue on Thursday, with operating income of $2.7 billion, up 35 percent from the previous year. Licensing revenue rose 61% to $1.13 billion, while royalties, which track the number of chips sold using Arm technology, rose 20% to $1.54 billion.
CEO Haas said, "We've never ex…
Bloomberg: The U.S. government is paying a high price for banning Huawei equipment
Feb
Three years ago, the U.S. government began ordering the removal of equipment from Huawei and ZTE from telecommunications and security networks, citing national security threats.
More than 100 telecommunications U.S. suppliers are still using equipment from Huawei and ZTE to serve hundreds of thousands of customers, according to Bloomberg. At the same time, orders…
Infineon: Making chips in multiple places is a smart move
Feb
Helmut Gassel, chief marketing officer and board member of Infineon, said the chip industry needs to diversify production to ensure supply chain resilience and long-term growth.
According to the Nikkei Asian Review, Gassel noted that the chip industry has grown massively and that manufacturing in multiple locations is a smart move from a resilience standpoint. "W…